Special Issue on Fluid Flow and Heat Transfer Inside a Closed Domain

Submission Deadline: Dec. 20, 2014

  • Special Issue Editor
    • Cheng See Yuan
      Faculty of Mechanical Engineering, University of Technology, Malaysia (UTM), Johor Bahru, Johor, Malaysia
    • Samir K. Bhowmik
      Department of Mathematics, Al Imam Ibn Saud University, Riyadh, Saudi Arabia
    • Sharanjeet Dhawan
      Department of Mathematics, Central University of Haryana, Mahendergarh, India
  • Introduction

    Fluid flow and heat transfer is a burning issue in the field of applied mathematics and mechanical engineering because of its growing demand to achieve the state-of-the-art technology and improved performance in a wide range of engineering applications. A particular branch of this vast issue is the fluid flow and heat transfer in an enclosed domain. Conduction, convection and radiation are the different mode of heat transfer. Convective heat transfer is tightly coupled to the fluid flow solution. Flow and heat transfer phenomena caused by buoyancy and shear forces in enclosures have received considerable attention from researchers. Understanding of these two competing mechanisms is of great significance from both fundamental and practical standpoints. The thermal performance of enclosures has been a subject of interest for many years due to their ever increasing applications in lubrication technologies, heat exchangers for drying food, cooling of electronic devices, thermal insulation and fire propensity control in buildings, fluid dynamics in geothermal reservoirs and shallow wedge enclosures, food processing and nuclear reactors.

    This special issue invites investigators to contribute original research articles as well as review articles on the most recent developments and research efforts in the field of fluid flow and heat transfer in an enclosed domain with a view to providing guidelines for future research directions. Potential topics include, but are not limited to:

    Conductive, convective and radiative heat transfer

    Modeling and simulation for flow and heat transfer

    Heat transfer enhancement by Nanofluids

    Enclosed geometries with regular or irregular surfaces

    Computational methods for flow and heat transfer

    Flows influenced by external forces (e.g. gravitational, magnetic etc)

  • Guidelines for Submission

    Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.

    Papers should be formatted according to the guidelines for authors (see: http://www.applmath.org/submission). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.

  • Published Papers

    The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.

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